发明名称 |
Copper or copper alloy target/copper alloy backing plate assembly |
摘要 |
Provided is a copper or copper alloy target/copper alloy backing plate assembly in which the anti-eddy current characteristics and other characteristics required in a magnetron sputtering target are simultaneously pursued in a well balanced manner. This copper or copper alloy target/copper alloy backing plate assembly is used for magnetron sputtering, and the copper alloy backing plate is formed from low beryllium copper alloy or Cu-Ni-Si-based alloy. Further, with this copper or copper alloy target/copper alloy backing plate assembly, the copper alloy backing plate has electrical conductivity of 35 to 60% (IACS), and 0.2% proof stress of 400 to 850MPa. |
申请公布号 |
EP2626444(A2) |
申请公布日期 |
2013.08.14 |
申请号 |
EP20130167078 |
申请日期 |
2004.11.30 |
申请人 |
JX NIPPON MINING & METALS CORPORATION |
发明人 |
OKABE, TAKEO;MIYASHITA, HIROHITO |
分类号 |
C23C14/34;C22C9/00;C22C9/06;H01J37/34 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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