发明名称 Silicon carbide semiconductor device and method for manufacturing silicon carbide semiconductor device
摘要 <p>A silicon carbide semiconductor device and a method for manufacturing it, wherein the device comprises the following features. A first region (11) of a silicon carbide layer (10) constitutes a first surface (F1), and is of a first conductivity type. A second region (12) is provided on the first region (11), and is of a second conductivity type. A third region (13) is provided on the second region (12), and is of the first conductivity type. A fourth region (14) is provided in the first region (11), located away from each of the first surface (F1) and the second region (12), and is of the second conductivity type. A gate insulation film (21) is provided on the second region (12) so as to connect the first region (11) with the third region (13). A gate electrode (30) is provided on the gate insulation film (21). A first electrode (31) is provided on the first region (11). A second electrode (32) is provided on the third region (13).</p>
申请公布号 EP2626905(A2) 申请公布日期 2013.08.14
申请号 EP20130150810 申请日期 2013.01.10
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 HAYASHI, HIDEKI;MASUDA, TAKEYOSHI
分类号 H01L29/16;H01L29/06;H01L29/66;H01L29/78 主分类号 H01L29/16
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