发明名称 Substrate inspecting method and methods of manufacturing an element and a substrate
摘要 <p>A substrate inspection method allowing inspection of all a plurality of substrates each provided at its surface with a plurality of layers by determining quality of the plurality of layers as well as methods of manufacturing the substrate and an element using the substrate inspection method are provided. The substrate inspection method includes a step (S 100) of preparing the substrate (10) provided at its main surface with the plurality of layers, a film forming step (S200), a local etching step (S321), and an inspection step (S323) or a composition analysis step (S322). In the step (S321), a concavity (7) is formed in a region provided with an epitaxial layer of the main surface of the substrate by removing at least partially the epitaxial layer. In the inspection step (S323), the inspection is performed on the layer exposed in the concavity (7).</p>
申请公布号 EP1863077(B1) 申请公布日期 2013.08.14
申请号 EP20070008890 申请日期 2007.05.02
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 NAKAMURA, TAKAO;UEDA, TOSHIO;KYONO, TAKASHI
分类号 H01L21/66 主分类号 H01L21/66
代理机构 代理人
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