| 摘要 |
PROBLEM TO BE SOLVED: To provide a small sensor chip excellent in reliability, and to provide a process for manufacturing such a sensor chip conveniently. SOLUTION: The sensor chip comprises a sensor body having a plurality of terminals in the outside region of an active surface or on the surface opposite to the active surface through a front and rear conduction vias, and a protective material bonded to the sensor body through a sealing frame such that the active surface is sealed while providing an air gap. Narrower one of the gap between the extrapolating side of a plane on the active surface side of the protective material and a terminal or the gap between the extrapolating side and the wiring in the outside region of the active surface of the sensor body is set in the range of 2-50 μm, and the area of the protective material facing the sensor body is not larger than the area of the sensor body. COPYRIGHT: (C)2008,JPO&INPIT |
