发明名称 |
DIELECTRIC FILM FORMATION DEVICE AND DIELECTRIC FILM FORMATION METHOD |
摘要 |
A dielectric film forming apparatus and a method for forming a dielectric film so as to form a dielectric film with a (100) / (001) orientation. A dielectric film forming apparatus 10 includes a deposition preventive plate heating portion 19 that heats a deposition preventive plate 34 disposed in a position where particles discharged from a target 21 adhere. Sputtering gas is introduced from a sputtering gas introduction unit 14 into a vacuum chamber 11. The deposition preventive plate 34 is heated to a temperature higher than a film forming temperature so as to emit vapor from a thin film adhered to the deposition preventive plate 34. After a seed layer is formed on a substrate 31, the substrate 31 is heated to the film forming temperature, and AC voltage is applied to the target 21 from a power supply 13 and then, the target 21 is sputtered so as to form a dielectric film on the substrate 31. |
申请公布号 |
EP2626442(A1) |
申请公布日期 |
2013.08.14 |
申请号 |
EP20110830637 |
申请日期 |
2011.10.03 |
申请人 |
ULVAC, INC. |
发明人 |
KIMURA, ISAO;JINBO, TAKEHITO;KOBAYASHI, HIROKI;ENDOU, YOUHEI;OONISHI, YOUHEI |
分类号 |
C23C14/34;C23C14/02;C23C14/08;C23C14/35;C30B23/00;C30B23/02;C30B23/06;C30B29/32 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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