发明名称 ELECTRONIC COMPONENT HAVING MICROMECHANICAL MICROPHONE STRUCTUR AND METHOD FOR PRODUCTION
摘要 Measures are provided for improving the acoustic properties of a component (10) having a micromechanical microphone structure realized in a layer construction (20) over a substrate (1), and for simplifying the production method. The microphone structure of such a component (10) includes a diaphragm (11) deflectable by acoustic pressure, spanning a cavity (13) that acts as a rear-side volume in the rear side of the component, and includes a stationary, acoustically permeable counter-element (12) situated over the diaphragm (11). According to the invention, the layer construction (20) has, between the diaphragm (11) and the substrate (1), an enclosing layer (3) in which there is fashioned an acoustically transparent aperture (4). The diaphragm (11) is connected to the rear-side volume (13) via this aperture in the enclosing layer (3). Under the enclosing layer (3), the rear-side volume (13) extends laterally beyond this aperture (4).
申请公布号 EP2460365(B1) 申请公布日期 2013.08.14
申请号 EP20100721028 申请日期 2010.06.02
申请人 ROBERT BOSCH GMBH 发明人 REINMUTH, JOCHEN
分类号 H04R19/00 主分类号 H04R19/00
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