| 摘要 |
PURPOSE: A laser lift off method using various separation layer materials is provided to prevent the collapse of a separation layer by forming the separation layer on a sacrificial substrate. CONSTITUTION: A separation layer (200) is formed on a sacrificial substrate (100). A semiconductor element layer (400) is formed on the separation layer. The upper surface or the lower surface of the separation layer is separated by a laser lift off method. The separation layer includes a compound. |
