| 摘要 |
PURPOSE: A wiring board and a surface mounting type super capacitor using the same are provided to improve the confidentiality by minimizing the body part of a substrate. CONSTITUTION: A substrate body has an upper surface and a lower surface. An electrode mounting region (15) welds an electrode. A lead welding pattern (17) welds lead to the outside of the electrode mounting region. A pair of outer connecting pads (18) is formed at the lower surface of the substrate body. A pair of the outer connecting pads is electrically connected to the electrode mounting region and lead welding pattern, respectively. |
