发明名称 Liquid processing method and liquid processing apparatus
摘要 <p>A liquid processing method includes: placing a plate adjacently to at least one of surfaces of a target substrate, and supplying a process liquid into a gap between the plate and the target substrate, thereby forming a liquid film of the process liquid; subjecting the target substrate to a process using a state with the liquid film of the process liquid thus formed; and supplying a gas to the liquid film, thereby breaking the liquid film, after finishing the process.</p>
申请公布号 EP1791161(B1) 申请公布日期 2013.08.14
申请号 EP20060024286 申请日期 2006.11.23
申请人 TOKYO ELECTRON LIMITED 发明人 UCHIDA, NORITAKA;NAKAMORI, MITSUNORI
分类号 H01L21/67 主分类号 H01L21/67
代理机构 代理人
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