| 摘要 |
Leadframe (2) comprises a chip assembly region, a wire connecting region (10) and external electrical connecting strips (3a, 3b). A support part is provided which is coupled with a thermal connecting part (4). Independent claims are also included for (a) a radiation-emitting component having a radiation-emitting chip and the leadframe; and (b) a process for the production of the semiconductor component. |
