发明名称 Folded leadframe multiple die package
摘要 A multiple die package includes a folded leadframe for interconnecting at least two die attached to another leadframe. In a synchronous voltage regulator the folded leadframe, which is formed from a single piece of material, connects the high side switching device with the low side switching device to provide a low resistance, low inductance connection between the two devices.
申请公布号 US8508025(B2) 申请公布日期 2013.08.13
申请号 US201213492074 申请日期 2012.06.08
申请人 LIU YONG;MALDO TIBURCIO A.;YANG HUA;FAIRCHILD SEMICONDUCTOR CORPORATION 发明人 LIU YONG;MALDO TIBURCIO A.;YANG HUA
分类号 H01L23/495 主分类号 H01L23/495
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