发明名称 |
METHOD FOR PREVENTING EPOXY BLEED OUT OF LEAD FRAME |
摘要 |
<p>PURPOSE: An anti-epoxy bleed out method of a lead frame is provided to prevent the adhesion degradation of a tape by performing an anti-epoxy bleed out process after a tape attachment process. CONSTITUTION: A die pad and a plurality of leads are formed by using conductive materials. The conductive materials are pre-plated (S12). A tape is attached to the conductive materials (S13). An anti-epoxy bleed out process is performed after a tape attachment process (S14). [Reference numerals] (AA) Start; (BB) Finish; (S11) Shape is formed by using a reel type conductive material; (S12) Pre-plate; (S13) Tape is attached with a reel method; (S14) Anti-epoxy bleed output process is performed; (S15) Cut off</p> |
申请公布号 |
KR20130090031(A) |
申请公布日期 |
2013.08.13 |
申请号 |
KR20120011049 |
申请日期 |
2012.02.03 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
PARK, SANG YEARL |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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