发明名称 Structure and apparatus for cooling integrated circuits using copper microchannels
摘要 A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.
申请公布号 US8505617(B2) 申请公布日期 2013.08.13
申请号 US201213423659 申请日期 2012.03.19
申请人 BEZAMA RASCHID JOSE;COLGAN EVAN GEORGE;IYENGAR MADHUSUDAN K.;MAGERLEIN JOHN HAROLD;SCHMIDT ROGER RAY;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BEZAMA RASCHID JOSE;COLGAN EVAN GEORGE;IYENGAR MADHUSUDAN K.;MAGERLEIN JOHN HAROLD;SCHMIDT ROGER RAY
分类号 F28F7/00;H05K7/20 主分类号 F28F7/00
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