发明名称 |
Heat resistant substrate incorporated circuit wiring board |
摘要 |
A circuit wiring board including a wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and including a core substrate and a through hole conductor formed in the core substrate, the core substrate having a first surface and a second surface on an opposite side of the first surface, the through hole conductor providing electrical connection through the core substrate between the first surface and the second surface of the core substrate.
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申请公布号 |
US8507806(B2) |
申请公布日期 |
2013.08.13 |
申请号 |
US20090488224 |
申请日期 |
2009.06.19 |
申请人 |
KARIYA TAKASHI;FURUTANI TOSHIKI;KAWANISHI TAKESHI;IBIDEN CO., LTD. |
发明人 |
KARIYA TAKASHI;FURUTANI TOSHIKI;KAWANISHI TAKESHI |
分类号 |
H05K1/16 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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