发明名称 Electronic device with heat dissipation structure
摘要 An electronic device includes an enclosure. The enclosure includes a motherboard area and a power supply area adjacent to the motherboard area, which are both located at a first end of the enclosure, a hard disk drive area for mounting hard disk drives at a second end of the enclosure, and a fan area arranged between the motherboard area and the hard disk drive area.
申请公布号 US8508942(B2) 申请公布日期 2013.08.13
申请号 US201113191466 申请日期 2011.07.27
申请人 TIAN BO;WU KANG;HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.;HON HAI PRECISION INDUSTRY CO., LTD. 发明人 TIAN BO;WU KANG
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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