发明名称 Compound semiconductor device and method of manufacturing the same
摘要 A compound semiconductor device is provided with a substrate, an AlN layer formed over the substrate, an AlGaN layer formed over the AlN layer and larger in electron affinity than the AlN layer, another AlGaN layer formed over the AlGaN layer and smaller in electron affinity than the AlGaN layer. Furthermore, there are provided an i-GaN layer formed over the latter AlGaN layer, and an i-AlGaN layer and an n-AlGaN layer formed over the i-GaN layer.
申请公布号 US8507329(B2) 申请公布日期 2013.08.13
申请号 US201213591401 申请日期 2012.08.22
申请人 KIKKAWA TOSHIHIDE;IMANISHI KENJI;FUJITSU LIMITED 发明人 KIKKAWA TOSHIHIDE;IMANISHI KENJI
分类号 H01L21/8232 主分类号 H01L21/8232
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