发明名称 |
Semiconductor device and method for manufacturing semiconductor device |
摘要 |
A semiconductor device includes a plurality of semiconductor integrated circuits bonded to a structure body in which a fibrous body is impregnated with an organic resin. The plurality of semiconductor integrated circuits are provided at openings formed in the structure body and each include a photoelectric conversion element, a light-transmitting substrate which has stepped sides and in which the width of the projected section on a first surface side is smaller than that of a second surface, a semiconductor integrated circuit portion provided on the second surface of the light-transmitting substrate, and a chromatic color light-transmitting resin layer which covers the first surface and part of side surfaces of the light-transmitting substrate. The plurality of semiconductor integrated circuits include the chromatic color light-transmitting resin layers of different colors.
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申请公布号 |
US8507308(B2) |
申请公布日期 |
2013.08.13 |
申请号 |
US201113244397 |
申请日期 |
2011.09.24 |
申请人 |
TAKAHASHI HIDEKAZU;YAMADA DAIKI;MONMA YOHEI;IGUCHI TAKAHIRO;ADACHI HIROKI;YAMAZAKI SHUNPEI;SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
TAKAHASHI HIDEKAZU;YAMADA DAIKI;MONMA YOHEI;IGUCHI TAKAHIRO;ADACHI HIROKI;YAMAZAKI SHUNPEI |
分类号 |
H01L31/18 |
主分类号 |
H01L31/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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