发明名称 Upper layer film forming composition and method of forming photoresist pattern
摘要 An upper layer film forming composition for forming an upper layer film on the surface of a photoresist film includes (A) a resin dissolvable in a developer for the photoresist film and (B) a compound having a sulfonic acid residue group, the composition forming an upper layer film with a receding contact angle to water of 70° or more. The upper layer film forming composition of the present invention can form an upper layer film which has a sufficient transparency and is stably maintained without eluting the components into a medium without being intermixed with a photoresist film, can form a resist pattern with high resolution while effectively suppressing a defect, and can suppress a blob defect.
申请公布号 US8507189(B2) 申请公布日期 2013.08.13
申请号 US20070442377 申请日期 2007.09.21
申请人 KOUNO DAITA;NAKASHIMA HIROMITSU;NISHIMURA YUKIO;JSR CORPORATION 发明人 KOUNO DAITA;NAKASHIMA HIROMITSU;NISHIMURA YUKIO
分类号 G03F7/11;G03F7/26 主分类号 G03F7/11
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