Leveling agents for metal plating baths are provided. Plating baths containing such leveling agents provide metal deposits having substantially level surfaces. Such leveling agents may be selected to selectively incorporate desired levels of impurities into the metal deposit.
申请公布号
US8506788(B2)
申请公布日期
2013.08.13
申请号
US201213609267
申请日期
2012.09.11
申请人
WANG DEYAN;MIKKOLA ROBERT D.;BARCLAY GEORGE G.;ROHM AND HAAS ELECTRONIC MATERIALS LLC
