发明名称 Cooling active circuits
摘要 In one aspect, an assembly includes a panel that includes a first surface. The panel also includes a first active circuit coupled to the first surface of the panel and a cold plate having a first bore. The cold plate includes a first inner surface exposed by the first bore. The panel further includes a first thermally conductive material in contact with the first inner surface of the cold plate and the first active circuit.
申请公布号 US8508943(B2) 申请公布日期 2013.08.13
申请号 US20090580356 申请日期 2009.10.16
申请人 DANELLO PAUL A.;CHEYNE SCOTT R.;ELLSWORTH JOSEPH R.;TELLINGHUISEN THOMAS J.;RAYTHEON COMPANY 发明人 DANELLO PAUL A.;CHEYNE SCOTT R.;ELLSWORTH JOSEPH R.;TELLINGHUISEN THOMAS J.
分类号 H05K7/20;H01Q1/38 主分类号 H05K7/20
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