| 摘要 |
Example embodiments provide a method of de-chucking a wafer by alternating between using a direct voltage and an alternating voltage, and an apparatus for fabricating a semiconductor device using the same. The method of de-chucking a wafer comprises interrupting a chucking voltage applied to an electrostatic chuck, applying a first de-chucking voltage to the electrostatic chuck, and applying a second de-chucking voltage to the electrostatic chuck. |
