VIA CONNECTION STRUCTURES AND SEMICONDUCTOR DEVICES HAVING THE SAME, AND METHODS OF FABRICATING THE SAMES

摘要

PURPOSE: A via connection structure, a semiconductor device including the same, and manufacturing methods thereof are provided to prevent a contact failure by including a wiring barrier layer. CONSTITUTION: A substrate has a first side and a second side. The second side faces the first side. A through via structure (45a) includes a first end and a second end. An insulation layer (30) has a rewiring groove. A rewiring structure (50) includes a rewiring barrier layer and a rewiring part.