| 摘要 |
PURPOSE: An electroconductive adhesive is provided to reduce content of metal powder capable of reducing current loss by uniformizing contact surface, to be uniformly dispersed while maintaining constant thickness, to be easily mixed, and to able to reduce agglomeration of metal particles in a polymer. CONSTITUTION: An electroconductive adhesive composition(20) comprises a conductive filler comprising metal powder(21) and silver nanowire, a polymer resin, an additive, and a curing agent, and a curing accelerator. The silver nanowire has a particle diameter of 0.05-0.3 micron. The length is 10-100 micron. The metal powder is copper, palladium, gold, tungsten, platinum, nickel, iron, lead, zinc, molybdenum, aluminum or combination thereof. The metal powder has an average particle diameter of 0.5-20 micron. The content of conductive filler is 50-90 weight% of total weight of the electric conductive adhesive composition. |
