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发明名称
发光元件及其制造方法
摘要
本发明之课题系进一步提升发光层部经由透光性树脂结合层贴合有透光性元件基板之发光元件其取光效率。;本发明之解决手段系发光元件1具备:具有发光层部24之主化合物半导体层部10,以主化合物半导体层部10之一主表面做为第一主表面,另一主表面做为第二主表面;以及经由透光性树脂结合层71贴合于该主化合物半导体层部10之第二主表面侧之透光性元件基板70;且该透光性元件基板70系由化合物半导体所构成,于该透光性元件基板70之至少侧面形成异向性化学蚀刻所产生之粗面化部SF。
申请公布号
TWI405350
申请公布日期
2013.08.11
申请号
TW095126140
申请日期
2006.07.18
申请人
信越半导体股份有限公司 日本
发明人
萩本和德;山田雅人
分类号
H01L33/00
主分类号
H01L33/00
代理机构
代理人
桂齐恒 台北市中山区长安东路2段112号9楼;阎启泰 台北市中山区长安东路2段112号9楼
主权项
地址
日本
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