发明名称 MEMORY MODULE ASSEMBLY
摘要 <p>PURPOSE: A memory module assembly is provided to lower a height from a motherboard to a memory module by arranging a socket having the memory module in an accommodating groove. CONSTITUTION: A motherboard (110) has an accommodating groove. A socket (120) is formed in the accommodating groove and fixed to the motherboard. A memory module (130) is mounted on the socket. The memory module is electrically connected to the motherboard by the medium of the socket. The thickness of the socket is less than the total thickness of the thickness of the motherboard and the thickness of the memory module.</p>
申请公布号 KR20130088911(A) 申请公布日期 2013.08.09
申请号 KR20120009440 申请日期 2012.01.31
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHO, JEONG HYEON;LEE, JAE JUN;LEE, JUNG JOON;CHOI, BAEK KYU;SEO, SEUNG JIN
分类号 H01L23/50;H01R33/76 主分类号 H01L23/50
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