| 摘要 |
<p>PURPOSE: A liquid epoxy resin composition which is excellent in workability, void property, solder bond property, adhesion property and storage stability is provided, so that the resin composition is suitable for being used as a non-flow underfill material for a semiconductor encapsulation. CONSTITUTION: A liquid epoxy resin composition includes a liquid epoxy resin (A) having at least one liquid epoxy resin represented by the following chemical formula1 or chemical formula 2, (B) a phenol hardener, (C) 0.01-10 parts by weight of a promoter based on 100.0 parts by weight of the liquid epoxy resin (A), and 20-900 parts by weight of an inorganic filling agent based on 100.0 parts by weight of the liquid epoxy resin (A). In the chemical formula 1 and 2, R is halogen, a substituted or non-substituted C1-6 1 hydrocarbon group or a substituted or non-substituted C1-6 alkoxy group, x, y and z are respectively the fixed number of the 0-4, and A is a single bond, an ether group, a thioether group, a SiO2 group or a bivalency hydrocarbon group with C1-6.</p> |
