发明名称 |
METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE |
摘要 |
<p>PURPOSE: A method for manufacturing a silicon carbide semiconductor device is provided to stably manufacture the silicon carbide semiconductor device with constant electrical features by suppressing damage on the interface of metal and silicon carbide. CONSTITUTION: A pair of electrodes are composed of an anode (22) and a cathode (21). A target (23) is made of metal materials. A metal layer is formed on a silicon carbide base (10) by sputtering the target. The incident energy of a sputtering gas and the metal materials on the silicon carbide base is smaller than the combination energy of the silicon carbide. A high frequency voltage applied between the electrodes is 20 to 300V.</p> |
申请公布号 |
KR20130089188(A) |
申请公布日期 |
2013.08.09 |
申请号 |
KR20130008381 |
申请日期 |
2013.01.25 |
申请人 |
MITSUBISHI ELECTRIC CORPORATION |
发明人 |
CHIKAMORI DAISUKE;NISHIO YASUHIKO;YUTANI NAOKI |
分类号 |
H01L29/872 |
主分类号 |
H01L29/872 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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