发明名称 HEATING APPARATUS FOR HEATING HIGH LIGHT EMITTING DIODE LEAD FRAME
摘要 PURPOSE: An apparatus for heating an LED lead frame is provided to heat the LED lead frame rapidly to a test temperature and to heat a plurality of leads in the LED lead frame uniformly by heating the LED lead frame with a near infrared ray by installing a near infrared ray lamp. CONSTITUTION: An upper side heating part(230) is constituted with a plurality of lamps and a reflector installed in the rear of the lamp, and heats an LED lead frame at the upper side of the inserted LED lead frame. A lower side heating part(220) comprises a heating block, and heats the LED lead frame at the lower side of the inserted LED lead frame. The upper side heating part and the lower side heating part are installed up and down in correspondence to each other.
申请公布号 KR101293254(B1) 申请公布日期 2013.08.09
申请号 KR20110114440 申请日期 2011.11.04
申请人 发明人
分类号 G01R31/26;G01R31/02;H01L21/66 主分类号 G01R31/26
代理机构 代理人
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