| 摘要 |
Disclosed is a substrate processing apparatus for rapidly supplying a substrate from a carrier to a processing block. The carrier of which a wafer has been taken out is transferred from a wafer loading-in unit to an arrangement unit for retraction, a new carrier receiving a non-processed wafer is transferred to the wafer loading-in unit, a substrate holding unit for holding one hundred wafers in a shelf form is prepared when the wafer is supplied from the new carrier to a processing block, five wafers are collectively transferred by a second substrate transfer unit from the carrier to the substrate holding unit by a first substrate transfer unit, and then the wafers are transferred from the substrate holding unit to the processing block one by one. Five wafers are transferred to the substrate holding unit at a time, but the wafers are taken out of the substrate holding unit one by one. Accordingly, it is possible to rapidly supply the wafer without interruption in supplying the wafer to the processing block. |
