发明名称 |
RESIN COMPOSITION, PROTECTIVE FILM CONTAINING SAME, DRY FILM, CIRCUIT BOARD, AND MULTILAYER CIRCUIT BOARD |
摘要 |
<p>A resin composition which is capable of forming a film that has excellent heat resistance and slidability/bendability; a protective film for circuits, which uses the resin composition; and a dry film or the like which comprises the protective film are provided. Other aspects are a circuit board and a multilayer circuit board, each of which has excellent heat resistance and slidability/bendability. Furthermore, a protective film for circuit boards is provided, which is arranged in contact with a circuit of a printed wiring board, and contains a polyoxazolidone resin that has a weight average molecular weight of 3×104 or more.</p> |
申请公布号 |
KR20130089276(A) |
申请公布日期 |
2013.08.09 |
申请号 |
KR20137016596 |
申请日期 |
2011.12.26 |
申请人 |
MITSUI CHEMICALS TOHCELLO, INC. |
发明人 |
TAHARA SHUJI;YASUDA KIYOMI |
分类号 |
C08J5/18;B32B15/08;C08L79/04;H05K3/28 |
主分类号 |
C08J5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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