| 摘要 |
The present invention provides an aluminium alloy-copper alloy bond and a method for same, the bond being bonded by means of a novel aluminium alloy-copper alloy bonding method which exhibits excellent bonding properties, little material deformation during bonding, and excellent reliability. A bond in which one member to be bonded is an aluminium alloy, an other member to be bonded is a copper alloy, and the one member to be bonded and the other member to be bonded are metallic bonded, wherein: the one member to be bonded is an aluminium alloy including 3.0-8.0 mass% Cu and 0.1-10 mass% Si, with the remainder being Al and unavoidable impurities, and satisfies C+2.4xS>=7.8 where C (mass%) is the Cu concentration and S (mass%) is the Si concentration; and the other member to be bonded is a copper alloy having a higher solidus temperature than the one member to be bonded. |
