发明名称 METHOD FOR MAKING A REDISTRIBUTED ELECTRONIC DEVICE USING A TRANSFERRABLE REDISTRIBUTION LAYER
摘要 <p>A method of making an electronic device with a redistribution layer includes providing an electronic device (11,12) having a first pattern of contact areas(13), and forming a redistribution layer (29) on a temporary substrate (20). The redistribution layer (29) has a second pattern of contact areas (27) matching the first pattern of contact areas (13), and a third pattern of contact areas (23) different than the second pattern of contact areas (27). The second pattern of contact areas (27) is coupled to the third pattern of contact areas (23) through a plurality of stacked conductive and insulating layers. The first pattern of contact areas (13) is coupled to the second pattern of contact areas (27) on the transferable redistribution layer (29). The temporary substrate (20) is then removed to thereby form a redistributed electronic device.</p>
申请公布号 WO2013116168(A1) 申请公布日期 2013.08.08
申请号 WO2013US23519 申请日期 2013.01.29
申请人 HARRIS CORPORATION 发明人 REED, THOMAS;HERNDON, DAVID;DUNPHY, SUZANNE
分类号 H01L21/683;H01L21/66;H01L21/768;H01L23/522 主分类号 H01L21/683
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