| 摘要 |
The present invention relates to an apparatus for manufacturing a semiconductor device which comprises: a support portion which supports a wafer for manufacturing a semiconductor device having TSV (Through Silicon Via); and a supply portion which comprises a groove for containing process fluid and a supply hole slopingly formed in a vertical direction in order to transfer the process fluid contained in the groove. According to the invention, a semiconductor device having TSV (Through Silicon Via) can be manufactured by a wet process and consequently the quality of the semiconductor device having TSV can be improved. |
