RESIN COMPOSITION USED TO FROM RESIN LAYER OF METAL BASE SUBSTRATE, METAL BASE SUBSTRATE, AND METHOD FOR PRODUCING METAL BASE SUBSTRATE

摘要

Provided is a resin composition used in the formation of a resin layer of a metal base substrate which has a metal sheet, a metal foil, and the resin layer disposed between the metal sheet and the metal foil, wherein the resin composition comprises (A) bisphenol A-type phenoxy resin having a weight-average molecular weight of 4.0×104 to 4.9×104, (B) an inorganic filler, and (C) a silane coupling agent. When the silane coupling agent (C) content of the entire resin composition is c mass% and the inorganic filler (B) content of the entire resin composition is b mass%, the composition satisfies 5×10-2