发明名称 SOLID STATE IMAGING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a solid-state imaging device in which variation of charge transfer time due to the arrangement position of photosensitive elements can be reduced.SOLUTION: The solid-state imaging device includes a pixel array 1 in which photosensitive pixels for converting incident light into signal charges are arranged in array on a semiconductor substrate, charge detection parts 2 each provided for every 8 photosensitive pixels and converting signal charges output from 8 photosensitive pixels into an output signal, and a charge transfer part 3 provided between the 8 photosensitive pixels and the charge detection part 2. The charge transfer part 3 has transfer paths T11-T13 and T1-T4 for transferring signal charges from the photosensitive pixels PD1-PD8 to the charge detection part 2, and a plurality of transfer electrodes 31, 32 consisting of first and second transfer electrodes 311, 312 and 321, 322 arranged on the transfer paths T1-T4 in the charge transfer direction. The transfer paths T1-T4 formed under the first and second transfer electrodes have a width becoming narrower gradually in the charge transfer direction.
申请公布号 JP2013153091(A) 申请公布日期 2013.08.08
申请号 JP20120013666 申请日期 2012.01.26
申请人 TOSHIBA CORP 发明人 MATSUURA MASAKAZU
分类号 H01L27/148;H04N5/372 主分类号 H01L27/148
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