发明名称 CIRCUIT BOARD SYSTEM
摘要 A circuit board system, a circuit board arrangement and a method for producing a circuit board arrangement are disclosed. The system comprises a first circuit board and a second circuit board, each having a top side and a bottom side; at least one first electronic component mounted on the bottom side of the second circuit board. The first circuit board has, on its top side, a plurality of electrically conductive first contact elements. The second circuit board has, on its bottom side, a plurality of electrically conductive second contact elements. Further, a recess is formed in the first circuit board. The second circuit board is mountable on the first circuit board such that the bottom side of the second circuit board faces towards the top side of the first circuit board, that the at least one first electronic component is arranged at least partly in the recess; and that each of the first contact elements matches one of the second contact elements.
申请公布号 US2013203274(A1) 申请公布日期 2013.08.08
申请号 US201313762710 申请日期 2013.02.08
申请人 HARMAN BECKER AUTOMOTIVE SYSTEMS GMBH;HARMAN BECKER AUTOMOTIVE SYSTEMS GMBH 发明人 KRAFT GUENTHER;HENEKA ERIC;GANZ ARMIN;SCHROEDER JUERGEN;TRUMPP TILO
分类号 H01R12/52 主分类号 H01R12/52
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