| 摘要 |
PROBLEM TO BE SOLVED: To resolve the problems that it is difficult for a conventional semiconductor device to suppress increase in temperature in a semiconductor device, and that provision of a pipe and the like in which cooling medium flows in the semiconductor device causes increase in size of the semiconductor device.SOLUTION: An N-type semiconductor and a P-type semiconductor are laminated in an axial direction of a cylindrical outer package. By setting an outer diameter of one of the N-type semiconductor and the P-type semiconductor to be larger than an inner diameter of the outer package, the N-type semiconductor or the P-type semiconductor tightly contacts with the outer package. Thereby, heat transfer in the semiconductor can be improved, and increase in temperature of the semiconductor device can be suppressed. |
