| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting device manufacturing method which can accomplish high-precision mounting of light-emitting elements to bring a plurality of light-emitting elements as much close to a point light source as possible by effectively utilizing the self-alignment effect of junction members when they are fused by heating.SOLUTION: In the light-emitting device manufacturing method, three or more light-emitting elements 9 are mounted on a group of conductive members provided on a support substrate, the group of conductive members having mounting portions arranged in two or more columns by two or more rows, in which each one of the light-emitting elements 9 are mounted. The light-emitting device manufacturing method includes a step in which the light-emitting elements 9 are shifted from the mounting portions on a virtual line extending in a radial direction from substantially the center of the group of conductive members and placed on the group of conductive members via junction members, and the junction members are fused by heating, in which way the light-emitting elements 9 are mounted on the mounting portions by effectively utilizing the self-alignment effect of the junction members at fusion by heating. |
