| 摘要 |
PROBLEM TO BE SOLVED: To provide a package molding which enables light emitting components having different sizes to be mounted with high accuracy.SOLUTION: A package molding 10 of this invention has: a resin molding 11 having a recessed part 12 for housing a light emitting component 40; and a first lead 20 and a second lead 30 which are spaced away from each other and are exposed on a bottom surface 121 of the recessed part 12 of the resin molding 11. An exposed surface 21 of the first lead 20 has a first edge part 23 and a second edge part 25 which face each other sandwiching a placement region 60 of the light emitting component 40 in a first direction, and includes one first cutout part 24 located at the first edge part 23 and multiple second cutout parts 26 located at the second edge part 25. A dimension 60L of the placement region 60 of the light emitting component 40, which is measured in the first direction, is equal to or longer than a distance 601L between the first cutout part 24 and the second cutout parts 26 and is shorter than a distance 602L between the first edge part 23 and the second edge part 25. |
