发明名称 STACKED SUBSTRATE STRUCTURE
摘要 The instant disclosure provides a self-sealed stacked structure which includes a substrate unit, a first frame, a conductive unit and a blocker unit. The substrate unit includes a first and a second substrate, and a first frame sandwiched there-between. The conductive unit includes a plurality of first conductors and second conductors electrically connecting the first substrate, the first frame and the second substrate. The first and the second conductors are in electrical connection. A blocker unit including at least two first and at least two second blockers are surroundingly arranged around the plurality of first and second conductors, respectively. The first substrate and the first frame are connected in a sealed manner through the first blockers combined by the solder, where the first frame and the second substrate are connected in a sealed manner through the second blockers combined by the solder.
申请公布号 US2013201648(A1) 申请公布日期 2013.08.08
申请号 US201213470301 申请日期 2012.05.12
申请人 CHENG TSUNG-JUNG;UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.;UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD. 发明人 CHENG TSUNG-JUNG
分类号 H05K1/14 主分类号 H05K1/14
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