发明名称 |
Method for Forming Flexible Solar Cells |
摘要 |
The invention provides for a semiconductor wafer with a metal support element suitable for the formation of a flexible or sag tolerant photovoltaic cell. A method for forming a photovoltaic cell may comprise providing a semiconductor wafer have a thickness greater than 150 mum, the wafer having a first surface and a second surface opposite the first and etching the semiconductor wafer a first time so that the first etching reduces the thickness of the semiconductor wafer to less than 150 mum. After the wafer has been etched a first time, a metal support element may be constructed on or over the first surface; and a photovoltaic cell may be fabricated, wherein the semiconductor wafer comprises the base of the photovoltaic cell.
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申请公布号 |
US2013199611(A1) |
申请公布日期 |
2013.08.08 |
申请号 |
US201213366338 |
申请日期 |
2012.02.05 |
申请人 |
MURALI VENKATESAN;PRABHU GOPAL;DINAN, JR. THOMAS EDWARD;LELAND ORION;TWIN CREEKS TECHNOLOGIES, INC. |
发明人 |
MURALI VENKATESAN;PRABHU GOPAL;DINAN, JR. THOMAS EDWARD;LELAND ORION |
分类号 |
H01L31/0376;H01L31/18 |
主分类号 |
H01L31/0376 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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