| 摘要 |
PURPOSE: A semiconductor device including a voltage converter circuit and a manufacturing method of the semiconductor device are provided to improve reliability by using bonding options instead of metal options. CONSTITUTION: A wire is bonded to one of a first bonding pad (310) and a second bonding pad (315). A power supply line is electrically connected to the first bonding pad. A voltage converter circuit (335) is connected to the second bonding pad. The voltage converter circuit is activated when the wire is bonded to the second bonding pad to produce an internal power voltage, which is different from a voltage received by the voltage converter circuit through the wire and the second bonding pad, and supply the internal power voltage to the power supply line. The voltage converter circuit is deactivated when the wire is connected to the first bonding pad to allow the power supply line to receive a power voltage through the wire and the first bonding pad. [Reference numerals] (307) VPWR_I/O pad; (310) VPWR_INT pad; (315) VPWR_EXT pad; (320) OPT_HV pad; (325) GND pad; (327) I/O pad; (331) I/O circuit; (335) Down converter analog circuit; (340) Logic circuit (NAND flash memory); (345) Analog circuit; (350) Pump |
