| 摘要 |
PROBLEM TO BE SOLVED: To suppress an amount of a foreign object brought onto a substrate from a process liquid when the substrate is processed with the process liquid.SOLUTION: In order to easily spread a resist liquid on a wafer W on a spin chuck 20, a solvent of PGMEA, etc. is applied onto the wafer W in advance. Before the application, the solvent supplied from a solvent supply source 42 is stored in a distillation tank 51 temporarily and the solvent is heated in a heating part 53 to be vaporized. The vaporized solvent is cooled in a cooler 60 thereby conducting purification through distillation and removing particles in the solvent. The purified solvent is stored in a storage tank 71 temporarily and is supplied from a solvent supply path 74 to a solvent nozzle 40 above the spin chuck 20. Then, the solvent is discharged from the solvent nozzle 40 to the wafer W and is applied onto the wafer W. Further, the distillation tank 51 is periodically cleaned thereby suppressing the rise of the particle concentration of the solvent. |
