| 摘要 |
A light-emitting module includes a plate substrate, two circuit substrates, at least one LED chip, a plurality of wires and a molding component. The plate substrate includes a plurality of chip carriers protrudingly arranged from an upper surface and a lower surface of the plate substrate. The two circuit substrates directly stack on the upper and lower surface of the plate substrate, respectively, wherein a plurality of openings are arranged corresponding to the chip carriers penetrating therethrough and the upper surface of each chip carrier is at a higher or the same horizontal of the surface of the corresponding circuit substrate. The LED chip is arranged on each chip carrier. Each LED chip and the corresponding circuit substrates are electrically connected with a plurality of wires. Each of LED chips, each of chip carriers, wires and a portion of the circuit substrates are covered with the molding component.
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