SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES, POWER MODULE, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULES, AND PASTE FOR BONDING COPPER MEMBER

摘要

This substrate for power modules is obtained by laminating and bonding a copper plate, which is formed of copper or a copper alloy, onto the surface of a ceramic substrate (11). A nitride layer (31) is formed on the surface of the ceramic substrate (11) between the copper plate and the ceramic substrate (11). An Ag-Cu eutectic structure layer (32) having a thickness of 15 mum or less is formed between the nitride layer and the copper plate.