Plastic carrier for use with lead frame for light emitting diode chip of light emitting diode module, has mechanical connection for mounting optical elements, and insulation displacement contact for contacting light emitting diode chips

摘要

The plastic carrier (1) has an insulation displacement contact (3) provided on a surface (1a) of the plastic carrier for contacting one of the light emitting diode chips (2). A bore is provided for fixing the plastic carrier. A groove is provided at its edges for fixing the plastic carrier. A mechanical connection, particularly a snap connection is provided for mounting optical elements above the light emitting diode chip. An independent claim is included for a lead frame for a light emitting diode chip.