发明名称 Mounting Board and Circuit Device Using the Same
摘要 A mounting board includes: a core layer made of an insulating resin; a first conductive pattern provided on a front side of the core layer; a second conductive pattern provided on a back side of the core layer; and a via provided between a first electrode for a high current in the first conductive pattern and an external electrode including the second conductive pattern, the external electrode provided so as to correspond to the first electrode, the first conductive pattern and the second conductive pattern having the same film thickness, the via set at a resistance value lower than a resistance value of the first conductive pattern so that the high current flows to the external electrode through the via.
申请公布号 US2013199827(A1) 申请公布日期 2013.08.08
申请号 US201213571072 申请日期 2012.08.09
申请人 IGARASHI YUSUKE;KATO ATSUSHI;NARUSE TOSHIMICHI;SANYO ELECTRIC CO., LTD. 发明人 IGARASHI YUSUKE;KATO ATSUSHI;NARUSE TOSHIMICHI
分类号 H05K1/02 主分类号 H05K1/02
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