发明名称 |
Semiconductor Device and Method of Forming Pre-Molded Substrate to Reduce Warpage During Die Molding |
摘要 |
A semiconductor device has a substrate with a plurality of conductive vias formed through the substrate and conductive layer formed over the substrate. A first encapsulant is deposited over the substrate outside a die attach area of the substrate. The first encapsulant surrounds each die attach area over the substrate and the die attach area is devoid of the first encapsulant. A channel connecting adjacent die attach areas is also devoid of the first encapsulant. A first semiconductor die is mounted over the substrate within the die attach area after forming the first encapsulant. A second semiconductor die is mounted over the first die within the die attach area. An underfill material can be deposited under the first and second die. A second encapsulant is deposited over the first and second die and first encapsulant. The first encapsulant reduces warpage of the substrate during die mounting.
|
申请公布号 |
US2013200527(A1) |
申请公布日期 |
2013.08.08 |
申请号 |
US201313769302 |
申请日期 |
2013.02.16 |
申请人 |
STATS CHIPPAC, LTD.;STATS CHIPPAC, LTD. |
发明人 |
YANG DAEWOOK;KIM SEUNGWON;KIM MINJUNG |
分类号 |
H01L23/28;H01L23/538 |
主分类号 |
H01L23/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|