发明名称 BUFFER LAYER STRUCTURES SUITED FOR III-NITRIDE DEVICES WITH FOREIGN SUBSTRATES
摘要 Embodiments of the present disclosure include a buffer structure suited for III-N device having a foreign substrate. The buffer structure can include a first buffer layer having a first aluminum composition and a second buffer layer formed on the first buffer layer, the second buffer layer having a second aluminum composition. The buffer structure further includes a third buffer layer formed on the second buffer layer at a second interface, the third buffer layer having a third aluminum composition. The first aluminum composition decreases in the first buffer layer towards the interface and the second aluminum composition throughout the second buffer layer is greater than the first aluminum composition at the interface.
申请公布号 US2013200495(A1) 申请公布日期 2013.08.08
申请号 US201213366090 申请日期 2012.02.03
申请人 KELLER STACIA;SWENSON BRIAN L.;FICHTENBAUM NICHOLAS;TRANSPHORM INC. 发明人 KELLER STACIA;SWENSON BRIAN L.;FICHTENBAUM NICHOLAS
分类号 H01L29/20;H01L21/20 主分类号 H01L29/20
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