发明名称 |
CARRIER FOR MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE CARRIER |
摘要 |
Disclosed herein is a carrier for manufacturing a printed circuit board, the carrier including: a core member composed of a base substrate, first metal layers stacked on both surfaces of the base substrate, and second metal layers stacked on the first metal layers; and a protecting unit completely wrapping an outskirt part of the core member, so that physical and chemical stresses can be minimized through a structure where an outskirt part of a carrier is wrapped by a protecting unit, thereby improving the manufacturing yield of the printed circuit board.
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申请公布号 |
US2013199035(A1) |
申请公布日期 |
2013.08.08 |
申请号 |
US201313753727 |
申请日期 |
2013.01.30 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD.;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM KWANG YUNE;CHANG TAE EUN;CHO SUK HYEONG |
分类号 |
H05K3/42 |
主分类号 |
H05K3/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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